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About ASE Kaohsiung
Company Overview
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Vision & Mission
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Philosophy & Culture
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Social Responsibility
Environment Management
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Safety & Health Management
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ASEKH Ethics
Products
QUAD
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QFP
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LQFP/TQFP
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Stacked Leadframe
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BGA
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PBGA
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Stacked PBGA
Side by Side BGA
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HSBGA
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Cavity Down BGA
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L2BGA
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CSBGA
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PGA
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CSP
Leadless-BCC/BCC+/BCC++
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Leadless-QFN
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Leadless-LGA
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Leadless-aQFN
FBGA - LF/TF/VF/WF/UF BGA
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aCSP/WLCSP
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FCCSP
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Stacked CSP
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SiP
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MPBGA
Side by Side BGA
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SiP Module
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Stack Leadframe - QFP/LQFP/TQFP
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Stacked PBGA
Stacked CSP
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Hybrid (Flip Chip + Wire Bond)
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PiP (Package-in-Package)
PoP (Package-on-Package)
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Flip Chip
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Flip Chip CSP (FCCSP)
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Flip Chip BGA (FCBGA)
HP Flip Chip BGA
Ultra CSP
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Bumping
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Green Packaging
Services
Characterization Services
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Substrate Design Services
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Test Services
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eService
Quality Management
ASE Quality Policy
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Key Quality Roadmap
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Quality Certification
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QA Organization
Career
ASE Briefs
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Benefits and Working Life
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Human Resource Development
Training and Development
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Working Opportunities
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Recruiting Activities
R&D Substitute Service
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