Product Overview
This thin package solution has become available due to significant improvement in substrate and die thinning technology.
Package Total Thickness Package Profile Solder Ball Pitch
LFBGA 1.20~1.70mm Low Profile Fine Solder Ball Pitch
TFBGA 1.00~1.20mm Thin Profile Fine Solder Ball Pitch
VFBGA 0.80~1.00mm Very Thin Profile Fine Solder Ball Pitch
WFBGA 0.65~0.80mm Very Very Thin Profile Fine Solder Ball Pitch
UFBGA 0.50~0.65mm Ultra thin Profile Fine Solder Ball Pitch
* Small, thin and light package
* Flexible design
* Low cost and & time to market high volume production
* Competitive reliability performance (MSL3@260°C)

FBGA is commonly used in hand-held devices, like computer, communication, and consumer devices. Increasing demand for thin packages with high density performance make FBGA a highly competitive and reliable package solution to meet this growing demand. This package is highly recommended for Memory (SRAM, PSRAM, Flash, DRAM), Graph, ASIC, Digital and Analog products.

3x3 mm to 21x21 mm body size available
Max 672 I/Os
0.4/0.5/0.65/0.75/0.8/1.0 mm in ball pitch
Rigid and customized routing substrate design
High density interconnection
Full in-house design capability
Fine pitch wire bond capability
Low assembly cost
Self-alignment during re-flow
High speed performance
Lower profile (Package thickness)
RoHS/ Pb Free & Green Package process ready and available
Ease of thermal and electrical management
Ease of routing
JEDEC standard criteria

Test Item Reference Condition/Duration
MSL Level 3 JEDEC 22-A103 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 500, 1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI, 50/100, hrs
HTST JEDEC 22-A103-B 150°C 500/1000 hrs
THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs

Package Structure
Total Thickness (Max) mm 1.20~1.70 1.2 1 0.8 0.65
Mold ThicknessPackage size (A) mm 0.53~0.91 0.45~0.70 0.45~0.53 0.30~0.45 0.25~0.3
Substrate thickness (B) mm 0.21~0.56 0.21~0.36 0.21~0.26 0.17~0.21 0.13~0.17
Solder ball height (C) mm 0.16~0.46 0.16~0.40 0.07~0.23 0.06~0.21 0.02~0.14
Wafer thickness (D) um 125~200 125~200 100~150 75~100 50~75
Max Epoxy (E) um 50 50 38 25 25
Max Loop height (F) um 200 150 140 125 100

For more information, please contact ASE sales office.
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