CSP  Leadless-LGA

Product Overview
Land grid array (LGA) uses laminate substrate to form the landing pad and the exposed pad for performance enhancement. It is essentially a BGA minus the solder balls. LGA’s advantage over other leadless packages are its flexible routing and multi-chip module capability. LGA is also a thinner (down to 0.5 mm) and lighter CSP. LGA technology has been developed for lead free solution and spacing reduction on mother boards. This type of package has chip size solution based on mature laminated substrate technology and material.

LGA is suitable for high performance ICs like Single Chip, CPU, Logic and Memory. Common applications for this type of package includes:
Telecommunication products
Cellular phone-RF Devices
Wireless LAN

Portable products
Personal digital assistants
Digital camera
IC recorders
MP3 players

Memory card
SD card
MS card

Thinner, lighter and smaller Chip-Scale Package
Mature standard matrix BGA assembly process
Higher yield/quality
Higher though-put
Lower cost
Space reduction in system level
Pb free solution
Excellent electrical and thermal performance

Test Item Reference Standard Condition/Duration
MSL JEDEC22-A103 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 96 hrs
HTST JEDEC 22-A103-B 150°C, 1000 hrs

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