| Product Overview |
| |
Flip Chip Organic BGA
Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency applications.
Flip Chip Ceramic BGA
Alumina ceramic substrate offers better moisture resistance, electrical insulating property and higher thermal conductivity than organic substrate. FCBGA is used primarily for high-reliability commercial applications (e.g. CPU). |
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| Application |
| |
Computer
Graphics/chipsets for PC
Server
Game console and High-end application
Microprocessor for PC & Server
memory
Telecommunications
Network products (LAN)
Switching
Transmission
Cellular Base Stations |
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| Features |
| |
| Substrate |
4 layer laminate, 4~12 layer & 800 / 400 um Build-up substrates, and ceramic substrates are available for different application |
| Passive Component |
Passive component attaching is available. It can be placed on the top or bottom side of the package |
| Ceramic BGA |
High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages |
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|
| Reliability |
| |
| Package Level |
| MSL Level 4 |
220 °C |
| TCT-B |
1000 cycles |
| THT |
1000 hrs |
| HTST |
1000 hrs |
| PCT |
96 hrs (For Reference Only) |
| HAST |
100 hrs |
|
| |
| Board Level (Contact ASE for further details.) |
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