SiP  Stacked CSP

Product Overview
ASE offer Stacked Chip Scale Package (SCSP) that combines BGA and Leadframe package solutions onto each MCM type.

Another exclusive stacked die package offered by ASE is the Sandwich SCSP. This unique package combines up to 5 dice stacked on top of another with one of the dice acting as a spacer in between. For more information on how Sandwich SCSP can solve your packaging problems, contact your local ASE office for further information.

The integration of several semiconductor technologies into single package offers excellent advantages for many applications where size, weight, electrical performance and board density are important considerations.

Stacked CSP is suitable for chip applications in cellular phones, PDA and various handheld electronics. Sandwich SCSP is suitable for applications in high density memory structure and also handheld electronics.

5x5 mm to 19x19 mm body size available
Different function integrated into package level
Full in-house flexible design capability
High speed and good electrical performance
RoSH / Green process available
Cost saving and time to market solution for multi-function package
Fine Pitch wirebond capability
Eliminate the use of second level package
JEDEC standard compliant

Package Level
Test Item Reference Condition/Duration
MSL Level 3 JEDEC 22-A103 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI, 100, hrs
HTST JEDEC 22-A103-B 150°C 1000 hrs

For more information, please contact ASE sales office.
2009 ASE Kaohsiung, All rights reserved. Terms of Use