| Product Overview |
| |
ASE offer Stacked Chip Scale Package (SCSP) that combines BGA and Leadframe package solutions onto each MCM type.
Another exclusive stacked die package offered by ASE is the Sandwich SCSP. This unique package combines up to 5 dice stacked on top of another with one of the dice acting as a spacer in between. For more information on how Sandwich SCSP can solve your packaging problems, contact your local ASE office for further information. |
|
| Application |
| |
The integration of several semiconductor technologies into single package offers excellent advantages for many applications where size, weight, electrical performance and board density are important considerations.
Stacked CSP is suitable for chip applications in cellular phones, PDA and various handheld electronics. Sandwich SCSP is suitable for applications in high density memory structure and also handheld electronics. |
|
| Features |
| |
| 5x5 mm to 19x19 mm body size available |
| Different function integrated into package level |
| Full in-house flexible design capability |
| High speed and good electrical performance |
| RoSH / Green process available |
| Cost saving and time to market solution for multi-function package |
| Fine Pitch wirebond capability |
| Eliminate the use of second level package |
| JEDEC standard compliant |
|
|
| Reliability |
| |
| Package Level |
| Test Item |
Reference |
Condition/Duration |
| MSL Level 3 |
JEDEC 22-A103 |
30°C/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 PSI, 100, hrs |
| HTST |
JEDEC 22-A103-B |
150°C 1000 hrs |
|
|
