| Product Overview |
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| BCC (bump chip carrier) uses plating metal pads (so-called “terminals”, as small as 0.4X0.3mm) to connect with the PCB. The terminals, which are etched from copperbased lead frame during packaging process, can be placed on the periphery of package with in-line or staggered layout. BCC+ and BCC++ both have exposed die pads, which can be soldered to the PCB. This direct heat path can enhance the thermal performance. BCC++ further intensifies the electrical performance by allocating a ground ring, which is extended from the die pad, to allow wire bonding. This common ground can reduce the ground inductance and curb the inductive noise. The BCC packages are suitable for applications of over 12GHz working frequency. |
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| Application |
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| The BCC series package is very suitable for small size and light weight packages that requires excellent electrical and thermal performance. Any application requiring high frequency and high power package performance, light weight, and small package size can choose BCC package, especially for telecommunications (wireless application like cellular phone, handset, PDA, wireless card, base station and wireless LAN), portable products (like personal digital assistants and digital camera) and low to medium lead count packages (for information appliances application). |
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| Features |
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| Small package size, light weight |
| Package height 0.8mm max |
| Existing BOM and process flow |
| Excellent thermal performance |
| Excellent electrical performance |
| Mass production for over 2.5 years, shipped over 150 million products |
| Assembly yield over 99.85% |
| Suitable for high frequency application |
| Custom-design available |
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| Reliability |
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| Package Level |
| Test Item |
Reference Standard |
Condition/Duration |
| MSL |
JEDEC 22-A103 |
Level 3, 30°C/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 100/300/500/1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 PSI 48/96 hrs |
| HTST |
JEDEC 22-A103-B |
150°C, 500/1000 hrs |
| THT |
JEDEC 22-A101-B |
85’C/85%RH 500/1000 hrs |
| PCT |
JEDEC 22-A102 |
121°C/100%RH/15 psi ,96/168/300 hours |
| Thermal shock test |
JEDEC JESD22-A106 |
-65°C~150°C, 100 / 300 / 500 cycles |
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| MSL for BCC+ is the same as BCC++ |
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| Board Level (Contact ASE for further details.) |
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