Product Overview
Heat slug BGA (HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted. The heat slug is intended to lower the thermal resistance (θJA) of PBGA without change of material. The θJA of HSBGA is generally 20% lower than PBGA and achieves 5 to 6W of thermal dissipation under natural convection. This technology can be applied to any kind of die-up substrates (e.g. 2- or 4-layer BT, and metal core). HSBGA is an excellent solution for cost-effective high power package, high- speed ICs like graphics chips, communication and networking ICs.

HSBGA is excellent for products that require improved thermal performance such as high power packages for high speed ICs in personal computers, networking and graphic ICs, data communication, consumer ICs and in telecommunication applications.

HSBGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.
15x15 mm to 45x45 mm package available
120 balls to 1520 ball count available
Cost effective
Good electrical performance
Good thermal performance
Good power dissipation
JEDEC MS-034 standard outlines
Lead free process ready and available
Full In-house design capability
Full electrical and thermal characterization capability

Package Level
Test item Reference Standard Condition/Duration
MSL JEDEC22-A103 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 96 hrs
HTST JEDEC 22-A103-B 150°C, 1000 hrs

For more information, please contact ASE sales office.
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