PGA




Product Overview
 
Pin Grid Array (PGA) is a microchip design that has the silicon core of the microchip facing down toward the motherboard. The core is covered by a heat slug, which helps to dissipate the heat to the heatsink better. As IC technology becomes faster, more complex and more powerful, the demands for high-performance packaging increases. The thermal, mechanical and electrical performance of the package should match the requirement of the device. PGA, with its excellent thermal, mechanical and electrical performance, can meet the high performance requirements.



Application
 
PGA is suitable for highly demanding/high-performance microprocessors.



Features
 
 
Excellent thermal performance
Excellent electrical performance
High mechanical strength
Excellent high frequency insulation
No water absorption



Reliability
 
Package Level of Regular BOM

Test Item

Reference Standard

Condition/Duration

TCT

-40ºC~150ºC

1000 cycles (MIL STD-883)

TST

-65ºC~150ºC

1000 cycles (MIL-STD-883)




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