Product Overview |
|
Pin Grid Array (PGA) is a microchip design that has the silicon core of the microchip facing down toward the motherboard. The core is covered by a heat slug, which helps to dissipate the heat to the heatsink better. As IC technology becomes faster, more complex and more powerful, the demands for high-performance packaging increases. The thermal, mechanical and electrical performance of the package should match the requirement of the device. PGA, with its excellent thermal, mechanical and electrical performance, can meet the high performance requirements. |
|
Application |
|
PGA is suitable for highly demanding/high-performance microprocessors. |
|
Features |
|
|
|
Excellent thermal performance |
Excellent electrical performance |
High mechanical strength |
Excellent high frequency insulation |
No water absorption |
|
|
Reliability |
|
Package Level of Regular BOM |
Test Item |
Reference Standard |
Condition/Duration |
TCT |
-40ºC~150ºC |
1000 cycles (MIL STD-883) |
TST |
-65ºC~150ºC |
1000 cycles (MIL-STD-883) |
|
|