|Stacked leadframe with same features as QFP/LQFP/TQFP is available now, with multi-chip structures.
Total thickness is according to JEDEC definition. They are ideal for applications in lightweight and portable electronic products.
Depending on lead counts, die counts and thickness requirements, this works with almost all applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs.
Personal digital assistants
Medium lead count packages
LQFP / TQFP
LQFPs are ideal package for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include lap-top PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards.
Exposed Pad TQFP provides better thermal performance which gives IC designers the needed margin for high performance products. Common application of Exposed Pad TQFP packages are telecommunication, wireless, pagers, disk drives and RF modules.
|Stacked QFP/LQFP/TQFP Package Offering:
(Please refer to QFP/LQFP/TQFP in details.)
|7 x 7 ~28 x 28 mm body size available
|Wide selection of pad size to meet die requirements
|Customize leadframe design capability
|32 ~ 256 leads counts available
|Fine Pitch wirebond capability
|Lead free process ready and available
|High conductivity Copper leadframes
|Low stress die attach materials
|Power enhancement version
|JEDEC Level 3 30°C/60%RH/192hours
|121°C/100%RH/15 psig, 300 hours
|65~150°C 1000 cycles
|130°C/85% RH 96hours
|150°C 1000 hours
|85°C/85% RH 1000 hours
|Board Level (Contact ASE for further details.)