SiP  Stack Leadframe - QFP/LQFP/TQFP

Product Overview
Stacked leadframe with same features as QFP/LQFP/TQFP is available now, with multi-chip structures.

Total thickness is according to JEDEC definition. They are ideal for applications in lightweight and portable electronic products.

Depending on lead counts, die counts and thickness requirements, this works with almost all applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs.

Telecommunication products
Cellular phone
Wireless LAN

Portable products
Personal computer
Personal digital assistants
Digital camera

Medium lead count packages
Information appliances

LQFPs are ideal package for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include lap-top PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards.

Exposed Pad TQFP provides better thermal performance which gives IC designers the needed margin for high performance products. Common application of Exposed Pad TQFP packages are telecommunication, wireless, pagers, disk drives and RF modules.

Stacked QFP/LQFP/TQFP Package Offering:
(Please refer to QFP/LQFP/TQFP in details.)
7 x 7 ~28 x 28 mm body size available
Wide selection of pad size to meet die requirements
Customize leadframe design capability
32 ~ 256 leads counts available
Fine Pitch wirebond capability
Lead free process ready and available
High conductivity Copper leadframes
Low stress die attach materials
Power enhancement version

Package Level
MSL JEDEC 22-A113 JEDEC Level 3 30°C/60%RH/192hours
PCT JEDEC 22-A102 121°C/100%RH/15 psig, 300 hours
TCT JEDEC 22-A104 65~150°C 1000 cycles
HAST JEDEC 22-A118 130°C/85% RH 96hours
HTST JEDEC 22-A103 150°C 1000 hours
THT JEDEC 22-A101 85°C/85% RH 1000 hours
Board Level (Contact ASE for further details.)

For more information, please contact ASE sales office.
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