| Product Overview |
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| PiP (Package-in-Package) is an option which can be used to decouple the stacking design from die design or when KGD (known good die) is not available. PiP can provide excellent electrical performance for memory bus and integration at assembly. PiP provides a smaller form factor compared with PoP. |
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| Application |
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PiP offers excellent advantages for many applications where size, weight, electrical performance and board density are important considerations. The KGD solution for memory package (internal) can provide high FT yield performance after burn-in.
The outline of PiP is same as single package. There is no additional process needed with FT and SMT at end customer.
PiP is suitable for applications such as Cellular phone, Wireless LAN, PDA and various handheld electronics. |
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| Features |
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| Package stacking |
| Mold CPD to Mold CPD adhesion |
| WB type PiP, FC+WB PiP |
| KGD solution |
| Green Package solution available |
| High speed performance |
| Good Electrical performance |
| Different devices integrated onto one package |
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| Reliability |
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| Package Level |
| MSL |
JEDEC Level 3, 30°C/ 60% RH |
192 hours |
| TCT |
–65°C ~ 150°C |
1000 cycles |
| HAST |
130°C/ 85% RH/33.5 PSIG |
96 hours |
| HTST |
150°C |
1000 cycles |
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| Board Level |
| TCT |
0~100°C, 2 CPH W/10 minute ramps and 5 minute duells respectively |
1000 cycles |
| THT |
85°C/ 85% RH |
1000 hours |
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