| Product Overview |
| |
| QFN |
| Based on copper lead frame, Quad Flat No-lead (QFN) or microchip carrier uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. QFN packages are suitable for applications over 12GHz working frequency. Providing both thermal and electrical enhancement, QFN is a cost-effective packaging solution due to its economical materials and simpler packaging process. |
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| Application |
| |
Telecommunication
products
Cellular phones
Wireless LAN
Portable
products
Personal digital assistants
Digital cameras
Low
to medium lead count packages
Information appliances |
|
| Features |
| |
| Small footprint |
| Low profile (< 0.9 0.2 L/F + 0.65 Mold) |
| Light weight |
| Cost effective |
| Better electrical performance |
| Better power dissipation |
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| Reliability |
| |
| Package Level |
| MSL |
JEDEC 22-A113 |
JEDEC Level 2Aa 60°C/60%120 hours for PPF lead frame
JDEEC Level 2Aa 60°C/60%120 hours for Cu lead frame |
| PCT |
JEDEC 22-A102 |
121°C/100%/2 atm 100 hours |
| TCT |
JEDEC 22-A104 |
65~150°C 1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH 100 hours |
| HTST |
JEDEC 22-A103 |
150°C 1000 hours |
| THT |
JEDEC 22-A101 |
85°C/85% RH 1000 hours |
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