CSP  Leadless-QFN

Product Overview
Based on copper lead frame, Quad Flat No-lead (QFN) or microchip carrier uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. QFN packages are suitable for applications over 12GHz working frequency. Providing both thermal and electrical enhancement, QFN is a cost-effective packaging solution due to its economical materials and simpler packaging process.

Telecommunication products
Cellular phones
Wireless LAN

Portable products
Personal digital assistants
Digital cameras

Low to medium lead count packages
Information appliances

Small footprint
Low profile (< 0.9 0.2 L/F + 0.65 Mold)
Light weight
Cost effective
Better electrical performance
Better power dissipation

Package Level
MSL JEDEC 22-A113 JEDEC Level 2Aa 60°C/60%120 hours for PPF lead frame
JDEEC Level 2Aa 60°C/60%120 hours for Cu lead frame
PCT JEDEC 22-A102 121°C/100%/2 atm 100 hours
TCT JEDEC 22-A104 65~150°C 1000 cycles
HAST JEDEC 22-A118 130°C/85% RH 100 hours
HTST JEDEC 22-A103 150°C 1000 hours
THT JEDEC 22-A101 85°C/85% RH 1000 hours

For more information, please contact ASE sales office.
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