Characterization Services

The Complete Technical Service Provider
ASE provides superior technical analysis and consulting services to improve the developing process on IC packaging, and allow circuit designers the maximum flexibility in the designs.

Electrical Characterization

Material Characterization

Stress & Reliability Characterization

Thermal Characterization

Electrical Characterization
ASE Electrical Laboratory is dedicated to provide IC package electrical characteristics design and analysis in terms of simulation and measurement techniques. ASE also works closely with customers to co-design custom IC packaging solutions. The characterization services include:

R.L.C for critical Traces
R.L.C for Min/Max Traces
IBIS Model
Power Noise Analysis
Ground Noise Analysis
S-parameters Analysis
Impedance Analysis
Cross Talk Noise Analysis
Noise Isolation Analysis
Signal Integrity Analysis
Customized Design Service

Material Characterization
ASE performs evaluation on material properties ( physical, chemical, surface and mechanical ) for new materials and optimization on material performance and process parameters for existing materials. This is done to improve reliability, reduce production cycle time and reduce manufacturing cost without trading off product quality. The characterization services include:

Property Characterization
• Tg ( glass-transition temperature )
• CTE (coefficient of thermal expansion )
• Curing kinetics
• Modulus
• Gel point
• Particle size distribution
• Filler content
• Weight loss
• Curing degree
• Viscosity and thixotropic index
• Ionic content
• Molecular weight distribution
• Organic functional group
• Mixture composition
• Surface roughness
• Surface chemical composition

Failure Mechanism Analysis
• Encapsulant: Incomplete fill / Wire sweep / Warpage / Delamination / Void
• Silver epoxy: Outgassing / Delamination / Void / Bleed
• Substrates: Warpage / Contamination / Crack
• Flux: Flux residue / Outgassing / Corrosion
• Lead frame: Contamination / Moisture uptake
• Under fill: Delamination / Void

Stress & Reliability Characterization
The stress & reliability characterization is used to analyze the stress issues and package reliability by numerical simulation and measurement. The analysis also consists of root cause investigation into packaging failure ( like die crack, delamination) and optimal design for low stress and high reliability. The characterization also provides component and system-level stress analyses to predict the fatigue life of solder joints, like temperature-cycle-test (TCT), bending test, and other reliability tests. The characterization services include:

Thermal Stress Characterization
• Warpage & component stress prediction
• Warpage & component stress measurement
• Packaging material selection & structure design
• Material properties measurement and test
• Package level reliability analysis
• Die strength flexural test
• Die pull test to evaluate UBM / Bump structural integrity

Process Simulation
Die-boding process dynamic simulation
Solder bump/ joint shape prediction

Board Level Reliability Test and Simulation
• Temperature cyclic test
• Bend cyclic test
• Drop test
• Failure analysis
• Solder joint reliability ( fatigue ) prediction
• Wire-bonding process dynamic simulation

Thermal Characterization
AAs operating frequency is getting higher and transistors shrink to nanometer regime, the power densities of devices become higher and higher. The needs for small form factor and functional integration (MCM/SiP) make thermal management more challenging. ASE can provide simulation and measurement services that help our customers to overcome thermal issues. These services include:

In pre-design phase:
• iTDAS (internet Thermal Data Automation Service) system
• Package recommendations
• External heat sink effect evaluations
• Preliminary thermal studies for MCM/SiP

In design phase:
• Hot spots impact evaluations
• Customized heat sink effects
• Transient analyses for power pulse impacts

In post-design phase:
• Compact Thermal Models (CTMs) for system-level simulations
• Simulations for packages in sockets (burn-in/HTOL test conditions)
• Thermal measurements

Thermal measurements include the measurements for package thermal parameters and material thermal conductivities:
JA (Junction-to-ambient thermal resistance)
JC (Junction-to-case thermal resistance)
JB (Junction-to-board thermal resistance)
JT (Junction-to-top thermal characterization parameter)
JB (Junction-to-board thermal characterization parameter)
• Material thermal conductivity measurements

If currently you are not ASE's customer but need our services, please contact:

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