| Product Overview |
| |
| Side by side MCM PBGA and side by side MCM HSBGA are the types of MCMs offered by ASE. MCM HSBGA includes multi heat slug for heat dissipation in different die layout (square, trapezoid and eclipse). |
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| Application |
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PC
Chipset
Graphics and Memory
Consumer
Game console
Set top box
Communication
PDA
Bluetooth modules |
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| Features |
| |
| 23x23 mm to 45x45 mm body size |
| Full in-house design capability |
| Fine Pitch wirebond capability |
| Lead free process available |
| High speed performance |
| Good thermal performance |
| Different devices integrated onto one package |
| Cost effective solution for high density package |
| Eliminate the use of second level package |
| Good electrical performance |
| JEDEC standard compliant |
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| Reliability |
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| Package Level |
| MSL |
JEDEC Level 3, 30°C/ 60% RH |
192 hours |
| PCT |
121°C/ 100% RH/ 2 atm |
168 hours |
| TCT |
–65°C ~ 150°C |
1000 cycles |
| HAST |
130°C/ 85% RH |
96 hours |
| HTST |
150°C |
1000 cycles |
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| |
| Board Level |
| TCT |
-40°C~125°C |
3500 cycles no failure |
| THT |
85°C/85% RH |
1000 hours no failed |
| Vibration test |
4 times of vibration for eash axis |
No failed |
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