| Product Overview |
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| Low profile and thin quad flat packages (QFP) are classified by the overall thickness (t) according to JEDEC definition: |
 L type: 1.2< t <=1.7 mm
T type: 1< t <=1.2 mm |
| Low profile and thin QFPs are becoming popular, as they are ideal for the applications in lightweight and portable electronic products. ASE offers the lead count of LQFP/TQFP ranging from 32 to 256 and 44 to 176 respectively, covering almost all the applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs. |
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| Exposed Pad L(T)QFP |
| The exposed pad can be soldered to the PCB so that the heat can be driven off directly (the JA is only half as much as the standard L(T)QFP). Besides, this pad is also electrically grounded, and thus results in far smaller ground inductance. Exposed pad L(T)QFP is a cost-effective solution suitable for enhancing thermal and electrical performance. |
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| Application |
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Telecommunication products
Cellular phones
Wireless LAN
Portable products
Personal computer
Personal digital assistants
Digital camera
Medium lead count packages
Information appliances
LQFP / TQFP
LQFPs are ideal package for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include lap-top PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards.
EP-TQFP
Exposed Pad TQFP provides better thermal performance which gives IC designers the needed margin for high performance products. Common application of Exposed Pad TQFP packages are telecommunication, wireless, pagers, disk drives and RF modules. |
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| Features |
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| LQFP/EP-LQFP Packing Offering |
| 7 x 7 mm to 28 x 28 mm body size available |
| Wide selection of pad size to meet die requirements |
| Customize leadframe design capability |
| 32 ~ 256 leads counts available |
| Fine Pitch wirebond capability |
| Lead free process ready and available |
| High conductivity Copper leadframes |
| Low stress die attach materials |
| Power enhancement version |
| JEDEC standard compliant |
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| TQFP/EP-TQFP Packing Offering |
| 10 x 10 mm to 20 x 20 mm body size available |
| Wide selection of pad size to meet die requirements |
| Customize leadframe design capability |
| 44 ~ 176 leads counts available |
| Fine Pitch wirebond capability |
| Lead free process ready and available |
| High conductivity Copper leadframes |
| Low stress die attach materials |
| Power enhancement version |
| JEDEC standard compliant |
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| Reliability |
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| Package Level |
| Test Item |
Reference Standard |
Condition/Duration |
| MSL |
JEDEC 22-A103 |
Level 3, 30°C/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 500/1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 PSI 48/96 hrs |
| HTST |
JEDEC 22-A103-B |
150°C, 500/1000 hrs |
| THT |
JEDEC 22-A101-B |
85°C/85%RH 500/1000 hrs |
| PCT |
JEDEC 22-A102 |
121°C/100%RH/15 psi ,96/168 hours |
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| Board Level (Contact ASE for further details.) |
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