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ASE prides itself as a leader in IC packaging and test by providing a total solution from wafer probe, substrate design and manufacturing, packaging, test and module assembly. We possess the required expertise in product and advanced process technology for the manufacture of CSP, MCM/stacked-die/3D, thermally enhanced packages, high frequency packages, flip chip packages, wafer bumping, and wafer level CSP. The collaboration among affiliated companies within the ASE Group has enabled us to vertically link up activities across the manufacturing value chain. ASE’s one-stop solution gives our customers clear benefits of improved time-to-market and total cost management.
Covering all existing and developing IC packages available at ASE, this product information provides detailed descriptions of the performance, package outline, characterization data, standard processes, and materials of each product.
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