| Product Overview |
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ASE offers Stacked Chip Scale Package (SCSP) that combines BGA and Leadframe package solutions onto each MCM type.
Another exclusive stacked die package offered by ASE is the Sandwich SCSP. This unique package combines up to 5 dice stacked on top of another with one of the dice acting as a spacer in between. For more information on how Sandwich SCSP can solve your packaging problems, contact your local ASE office for further information. |
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| For more details, please refer to SiP_Stacked CSP |
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