Product Overview |
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ASE offers stacked Ball Grid Allay package that combines BGA package solutions onto MCM type. Stacked BGAs are also one of the most SiP popular package solutions for flash & SRAM combination.
For more information on how SiP Stacked BGA can solve your packaging problems. Contact your local ASE office for further information. |
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Application |
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The integration of several semiconductor technologies into single MCM BGA package offers excellent advantages for many applications where size, weight, electrical performance and board density are important considerations. |
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Features |
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23x23 mm to 45x45 mm body size available |
Full in-house design capability |
Fine Pitch wirebond capability |
Pb free process available |
High speed performance |
Good thermal performance |
Different devices integrated onto one package |
Cost effective solution for high density package |
Eliminate the use of second level package |
Good electrical performance |
JEDEC standard compliant |
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Reliability |
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Package Level |
Test Item |
Reference Standard |
Condition/Duration |
MSL |
JEDEC 22-A103 |
Level 3, 30°C/60% RH, 192 hrs |
TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 1000 cycles |
HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 psi 96 hrs |
HTST |
JEDEC 22-A103-B |
150°C, 1000 hrs |
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