|ASE offers stacked Ball Grid Allay package that combines BGA package solutions onto MCM type. Stacked BGAs are also one of the most SiP popular package solutions for flash & SRAM combination.
For more information on how SiP Stacked BGA can solve your packaging problems. Contact your local ASE office for further information.
|The integration of several semiconductor technologies into single MCM BGA package offers excellent advantages for many applications where size, weight, electrical performance and board density are important considerations.
|23x23 mm to 45x45 mm body size available
|Full in-house design capability
|Fine Pitch wirebond capability
|Pb free process available
|High speed performance
|Good thermal performance
|Different devices integrated onto one package
|Cost effective solution for high density package
|Eliminate the use of second level package
|Good electrical performance
|JEDEC standard compliant
|Level 3, 30°C/60% RH, 192 hrs
|-65°C to 150°C, 1000 cycles
|130°C/85% RH, 33.5 psi 96 hrs
|150°C, 1000 hrs