Product Overview |
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Advanced Quad Flat No-lead. aQFN™ is solution for Lead less, multi-row and fine pitch lead frame package with enhanced Thermal/ Electrical performance. aQFN™ is a cost-effective packaging solution due to its economical materials and simpler packaging process. |
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Application |
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Telecommunication
products
Cellular phones
Wireless LAN
Portable
products
Personal digital assistants
Digital cameras
Low
to medium lead count packages
Information appliances |
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Features |
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Low profile, small footprint and light weight |
Free-form I/O design |
Fine lead pitch 0.4mm |
Excellent thermal performance |
Excellent electrical performance |
Good SMT performance |
Cost effective package |
Extend QFN I/O count up to 400 |
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Reliability |
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Package Level |
MSL |
JEDEC Level 3, 30°C/ 60% RH |
192 hours |
PCT |
121°C/ 100% RH/ 2 atm |
168 hours |
TCT |
–65°C ~ 150°C |
1000 cycles |
HAST |
130°C/ 85% RH/33.5 PSIG |
96 hours |
HTST |
150°C |
1000 cycles |
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Board Level |
TCT |
0~100°C, 2 CPH W/10 minute ramps and 5 minute duells respectively |
1000 cycles |
Drop Test |
JEDEC standard |
30 drops Min |
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