|Hybrid (F/C + W/B) is a package technology stacking one die on the top of probed good die to integrate an ASIC and memories such as flash, SRAM and DDR into one package, interconnecting them with wire bonding and molding. Hybrid packages deliver increased functionality and performance. Besides, they offer procurement flexibility, lowest packaging cost compared to individually package die and faster time to market. Normally designers use Hybrid package for wireless applications such as cell phones and consumer products like camcorders, digital camera and PDA etc.
Currently, the major concern to the packaging is KGD issue (Known good die). One bad die will ruin the entire module. Also, the rework is not an option. Therefore, probed good die is important before integration.
|Applications of Hybrid package include analog devices, ASIC, Baseband, Processor, integrated passives, and RF devices.
|Package size 7x7 mm to 14x14mm available
|Fine Pitch wire bond capability
|Green process available
|Smaller, Thinner and Lighter Packages
|Cost effective solution for high density package
|Higher performance structure for molding type
|Easy rework or change on board level process
|Stacked die solution
|JEDEC standard compliant