Flip Chip  Flip Chip CSP (FCCSP)

Product Overview
FCCSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os around 200 or less. FCCSP provides better protection for chip and better solder joint reliability compared with direct chip attach (DCA) or chip on board (COB). FCCSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FCCSP features thin and small profile, and lightweight packages.

Applications include RFICs and memory ICs. ASE provides packaging service for any customer-designed size at ball pitches ranging from 0.5 to 1.0mm, and no. of I/Os from 16 to 200. The types of encapsulation are underfi ll and overmold.

Digital Camera

Voltage regulators
High-speed Memory
PC Peripherals

Cellular handsets

Thinner Profile “Wafer Thinning” capability (down to 6~8 mils) to support packages thinner than 1.0 mm
Substrate 2-layer BT laminate substrate is used to reduce overall package cost
Improved Performance Thin core (100um) substrate & via-on-pad design can be adopted to achieve better electrical performance
Robust Structure Overmolded process can enhance throughput, component and board level reliability
NSMD with OSP C4 pad Low cost solutions for electric interconnect between solder bump and substrate

Package Level
MSL Level 3 220 °C
TCT-B 1000 cycles
THT 1000 hrs
HTST 1000 hrs
PCT 168 hrs
HAST 100 hrs
Board Level
• Weibull distribution of FCCSP 48L with different surface fi nish
• 0.30 mm dia. SN63/Pb37 solder ball
• Test Condition: -40 ~ 125 deg. Celsius air-to-air
• Ball composition of LF35 or SAC105 were applied on green /RoHS package

For more information, please contact ASE sales office.
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