| Product Overview |
| |
Flip chip bumping shows an increasing part of the whole packaging business and becomes a necessary technology in packaging house since the year 2000. While the wafer foundries are planning 12" wafer manufacturing for the cost-down reason and the ordering for 12" equipment overruns the ordering for 8" equipment consequently this year, the request of 12" wafer bumping technology arises accordingly. The trend of flip chip bumping technology is especially important for portable and performance-oriented electronics, such as ultra large scale integrated circuits, such as processors, microprocessors, DSPs and ASICs, chips that typically have 1000 connections.
Flip chip bumping technology has also advantage in the low-pin count chips in the portable electronics market and in cell phones, for which the form factor is decisive. |
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| Application |
| |
 Processors
Microprocessors
DSPs
ASICs |
|
| Features |
| |
Size reduction
Weight reduction
Improved electrical performance
Cost saving |
|
| Reliability |
| |
| Package Level |
| TCT |
JEDEC 22, A104-A
Condition B, -55°C to +125°C |
1000 cycles |
| PCT |
JEDEC 22B, A102-B
121°C/ 15 psig / 100% RH |
96 hours |
| THT |
JEDEC 22B, A101-A
85°C/ 85% RH |
168/ 500/ 1000 hours |
| HTST |
JEDEC 22B, A103-A, 150°C |
1000 hours |
|
|
| Standard Process/Materials |
| |
| UBM sputter deposition |
UBM: Al/NiV/Cu |
| Cap photolithography |
|
| Cap metal etch |
|
| Solder photolithography |
|
| Solder deposition |
Solder bump: Eutectic PbSn, High lead, Low alpha, Leadfree |
| Final inspection |
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|
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| Design Guideline |
| |
| Peripheral pitch |
Array pitch |
UBM diameter |
Max. Passivation opening diameter |
Minimum final metal size |
Bump height mean |
Min. Distance from bond
pad center to die edge |
| 381(15mil) |
NA |
178 |
152 |
191 |
140 |
167 |
| 330(13mil) |
NA |
152 |
127 |
165 |
130 |
142 |
| 254(10mil) |
NA |
152 |
127 |
165 |
130 |
167 |
| 204(8mil) |
NA |
102 |
80 |
115 |
100 |
95 |
| 152(6mil) |
NA |
90 |
70 |
102 |
87 |
128 |
| 128(5mil) |
NA |
75 |
55 |
88 |
75 |
105 |
| NA |
394(15.5mil) |
178 |
152 |
191 |
140 |
167 |
| NA |
343(13.5mil) |
152 |
127 |
165 |
130 |
142 |
| NA |
254(10mil) |
102 |
80 |
115 |
100 |
130 |
| NA |
Staggered2
27(9mil) |
102 |
80 |
115 |
95 |
108 |
| NA |
227(9mil) |
90 |
70 |
103 |
100 |
104 |
| NA |
204(8mil) |
80 |
60 |
93 |
90 |
91 |
| NA |
177(7mil) |
80 |
60 |
90 |
78 |
79 |
|
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