ASE Kaohsiung TOP > Products > Wafer Bumping > Solder Bumping
Wafer Bumping Solder Bumping
Product Overview
ASE’s wafer bumping service currently provides printed eutectic (63Sn/37Pb), high lead (90/10), low alpha (< 0.02 cph/cm2) eutectic solder bumping on 6” and 8” silicon wafers. The capacity will be 30000 pcs/month by the end of 2001. The fine-pitch capability of printed eutectic solder bumping is 160um for area array and 150um for peripheral type of devices.
To improve joint reliability and process yield of the wafer bumping on very fine peripheral bond pad, the redistribution process is needed. Redistribution technology allows the re-layout of the inter-connection from the locations of peripheral bond pads to new area pad array without changing the die design. This method widens the very fine pad pitch, and allows wider under bump metallurgy (UBM) for larger bumps. The advantages are extended thermal cycle fatigue life, better underfill flow, and greater tolerance of board flatness variation. ASE’s redistribution process will be service by 2001Q3.
