Product Overview |
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TSOP(I)/ TSOP(II)
TSOP(I) and TSOP(II) are thin profile small outline packages with an overall thickness of as thin as 1.1mm (cf. 2.6~2.8mm for SOP of the same I/O). TSOP(I) and TSOP(II) differ in the location of leads. TSOP(II) lines its leads on the narrow side, while TSOP(II) lines up its leads on the wide side. |
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Application |
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Due to its thin profile, TSOP is suitable for applications in portable electronic products, cell phones, and memory modules.
Telecommunication Products
Cellular Phone
Wireless LAN
Portable Products
Personal Digital Assistants
Digital Camera
Audio/Video
Low Pin Count Packages
Information Appliances |
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Features |
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Low profiles and lightweight |
Steady yield |
Low cost |
Pb-free Process ready and available |
TSOP(I) body size from 11.8x8 up to 18.4x12mils |
TSOP(II) body size from 17.1x7.6 up to 22.2x10.2mils |
TSOP(I) lead counts available 28/32/40/48 |
TSOP(II) lead counts available 20/24/40/44/50/54 |
JEDEC standard outlines |
Existing BOM and process flow |
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Reliability |
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Package Level |
Test Item |
Reference Standard |
Condition/Duration |
MSL |
JEDEC 22-A103 |
Level 3, 30°C/60% RH, 192 hrs |
TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 100/300/500/1000 cycles |
HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 PSI 48/96 hrs |
HTST |
JEDEC 22-A103-B |
150°C, 500/1000 hrs |
THT |
JEDEC 22-A101-B |
85°C/85%RH 500/1000 hrs |
PCT |
JEDEC 22-A102 |
121°C/100%RH/15 psi ,96/168 hours |
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Board Level (Contact ASE for further details.) |
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