Dual-in-Line  TSOP(I)/TSOP(II)





Product Overview
 
TSOP(I)/ TSOP(II)
TSOP(I) and TSOP(II) are thin profile small outline packages with an overall thickness of as thin as 1.1mm (cf. 2.6~2.8mm for SOP of the same I/O). TSOP(I) and TSOP(II) differ in the location of leads. TSOP(II) lines its leads on the narrow side, while TSOP(II) lines up its leads on the wide side.



Application
 
Due to its thin profile, TSOP is suitable for applications in portable electronic products, cell phones, and memory modules.

Telecommunication Products
Cellular Phone
Wireless LAN

Portable Products
Personal Digital Assistants
Digital Camera
Audio/Video

Low Pin Count Packages
Information Appliances



Features
 
Low profiles and lightweight
Steady yield
Low cost
Pb-free Process ready and available
TSOP(I) body size from 11.8x8 up to 18.4x12mils
TSOP(II) body size from 17.1x7.6 up to 22.2x10.2mils
TSOP(I) lead counts available 28/32/40/48
TSOP(II) lead counts available 20/24/40/44/50/54
JEDEC standard outlines
Existing BOM and process flow



Reliability
 
Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 100/300/500/1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI 48/96 hrs
HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs
PCT JEDEC 22-A102 121°C/100%RH/15 psi ,96/168 hours
 
Board Level (Contact ASE for further details.)



For more information, please contact ASE sales office.
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