ASE Kaohsiung TOP > Products > Dual-in-Line > SOP

Dual-in-Line  SOP Product Overview   The features of small outline package (SOP) are similar to SOJ, except that the leads' end is formed in the shape of a gull-wing. Application   ASE’s SOP product was designed in compliance with JEDEC standards. Applications includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video, and information appliances. Features   SOP Body sizes 154 up to 450 mils SOP lead counts available from 8 to 32 JEDEC standard outlines Existing BOM and process flow Pb-free process ready and available Reliability   Package Level Temp/Humidity test 85°C/ 85% RH, 1000 hr (JEDEC 22- A101) Pressure cooker test 121°C/ 100% RH/ 15 PSIG, 300 hr (JEDEC 22- A102) Temp cyclic test -65 ~ 150°C, 1000 CYCLES (MIL-STD-883-1010.7) High temp storage test 150°C, 1000 hr (JEDEC 22- A103) High accelerated stress test 130°C/ 85% RH/ 33.5 PSIA, 100 hr (JEDEC 22- A110)   Board Level (Contact ASE for further details.) For more information, please contact ASE sales office. 2009 ASE Kaohsiung, All rights reserved. Terms of Use