| Product Overview |
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TSOP(I)/TSOP(II)/TSOP(II) Tape-LOC
TSOP(I) and TSOP(II) refer to thin profile small outline package with an overall thickness of as thin as 1.1mm (cf. 2.6~2.8mm for SOP of the same I/O). TSOP(I) and TSOP(II) differ in the location of leads. TSOP(I) lines its leads on the narrow side, while TSOP(II) lines up its leads on the wide side. |
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| Application |
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Due to its thin profile, TSOP is suitable for applications in portable electronic products, cell phones and memory modules. LOC technology can be applied to TSOP(II).
Telecommunication Products:
Cellular Phone
Wireless LAN
Portable Products:
Personal Digital Assistants
Digital Camera
Audio/Video
Low Pin Count Packages:
Information Appliances |
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| Features |
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 Low profiles and lightweight
Existing BOM
Steady yield
Low cost
Pb free available
TSOP(I) body sizes from 11.8x8 up to 18.4x12 mils
TSOP(II) body sizes from 17.1x7.6 up to 22.2x10.2
TSOP(II) Tape-LOC body sizes from 18.4x10.2 up to 22.2x10.2 mils
TSOP(I) lead counts available 28/32/40/48
TSOP(II) lead counts available 20/24/40/44/50/54
TSOP Tape-LOC lead counts 24/44/50/54
JEDEC standard outlines
Existing BOM and process flow |
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| Reliability |
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| Package Level |
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| JEDEC precondition level 3 |
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| Visual Inspection |
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| Open/Short Test |
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| SAT Inspection |
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| Temperature Cycling |
150°C~-65°C |
5 Cycles |
| Baking @ 125°C/24 Hours |
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| Moisture Soak |
30°C/60%RH |
192 Hours |
| IR reflow |
225°C/3X |
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| Visual Inspection |
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| Open/Short Test |
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| SAT Inspection |
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| Temperature/Humidity test |
85°C/85%RH |
500 /1000 hours |
| Thermal shock |
-65°C~150°C |
100 / 300 / 500 cycles |
| Pressure cooker test |
121°C/100%RH/15 psig |
168 / 300 hours |
| Temperature cycles |
-65°C~150°C |
100 / 300 / 500 / 1000 cycles |
| HTST |
150°C |
500 / 1000 hours |
| HAST |
130°C/85%RH |
50 / 100 hours |
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| Board Level (Contact ASE R&D for details.) |
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| Design Rule |
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| Minimum Ink Size: 15mil (381 um) diameter or non-ink with wafer mapping |
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| Minimum Sawing street width: 3.0 mil (76.2 um) |
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| Wafer Thickness: Back grinding is required if the thickness exceeds ASE's stipulated range |
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| Pkg type |
Wafer thickness |
| TSOP(I)(II) |
10~12 mil (254~305 um) |
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| Wire Bond Rule |
| Wire size |
Min. bond pad pitch |
Min. bond pad opening |
Wire loop control |
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| 32 um (1.3mil) |
140 um |
96 um |
Max. wire length
loop height |
180
<20 mils |
| 30 um (1.2mil) |
90 um |
69 um |
Max. wire length
loop height |
180
<20 mils |
| 28 um (1.1mil) |
90 um |
65 um |
Max. wire length
loop height |
180
11~15 mils |
| 25 um (1.0mil) |
75 um |
63 um |
Max. wire length
loop height |
176
11~15 mils |
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| (1mm=39.37mil; 1mil=25.4um) |
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| Performance |
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| Electrical |
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| Electrical Characterization (Contact ASE R&D for details.) |
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| Thermal |
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TSOP(I) (All are measurement data.)
| Lead count |
Pkg size (mm) |
Pad size (mil) |
Die size (mil) |
L/F material |
PCB layer |
 JA(c/w) |
| 0(m/s) |
1(m/s) |
2(m/s) |
| 28 |
8X11.8 |
165X150 |
100X100 |
A42 |
4L |
91.2 |
86.1 |
81.6 |
| 32 |
8X18.4 |
240X551 |
200X200 |
A42 |
4L |
91.6 |
86.6 |
82.4 |
| 32 |
8X18.4 |
250X440 |
200X200 |
A42 |
4L |
99.4 |
94.3 |
89.6 |
| 32 |
8X18.4 |
275X310 |
200X200 |
A42 |
4L |
108.5 |
103.8 |
99.8 |
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TSOP(II) (All are measurement data.)
| Lead count |
Pkg size (mm) |
Pad size (mil) |
Die size (mil) |
L/F material |
PCB layer |
JA(c/w) |
| 0(m/s) |
1(m/s) |
2(m/s) |
| 32 |
18.4X10.2 |
145X390 |
100X100 |
A42 |
4L |
96.4 |
91.6 |
87.8 |
| 32 |
18.4X10.2 |
285X360 |
200X200 |
A42 |
4L |
52.7 |
49 |
45.8 |
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(1mm=39.37mil; 1mil=25.4um)
The above electrical data is for reference only. |
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| Standard Process/Materials |
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| TSOP(I)/TSOP(II) |
| Wafer mount |
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| Wafer saw/Clean |
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| 2nd optical (Gate) |
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| Die attach |
Epoxy: ABLESTIK 8361H
Lead frame: TSOP(I): C7025 (Cu)/A42
 TSOP(II): A42 |
| Epoxy cure |
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| Wire bond |
Gold wire: 99.99% Au |
| 3rd optical (Gate) |
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| Mold |
Compound: SUMITOMO EME-7320
SUMITOMO EME-S372(Memory device) |
| Laser backside marking |
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| Dejunk/Trim |
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| Post mold cure |
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| Electro deflash |
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| Solder plating |
Solder: Sn/Pb=85/15 |
| Top side marking |
White ink |
| Visual/Mechanical inspection (Gate) |
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| Form/Singulation |
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| Final visual inspection (Gate) |
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| Packing |
Bakeable thin tray |
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| Optional process: wafer back grinding/top side laser marking/dry packing |
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| Package Offering |
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| The alphabetical notation refers to: |
| A1 Stand-off |
| A2 Body thickness |
| b Lead width |
| c L/F thickness |
| e Lead pitch |
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| Overall thickness is the sum of A1 and A2. |
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| TSOP(I) (All units are in mil. 1mil=25.4um) |
| Body size |
Lead count |
A1 |
A2 |
L1 |
b |
c |
e |
| D1 |
E1 |
| 11.8 |
8 |
28 |
0.1 |
1 |
0.8 |
0.2 |
0.15 |
0.55 |
| 11.8 |
8 |
32 |
0.1 |
1 |
0.8 |
0.2 |
0.15 |
0.5 |
| 18.4 |
8 |
28 |
0.1 |
1 |
0.8 |
0.2 |
0.15 |
0.5 |
| 18.4 |
8 |
32 |
0.1 |
1 |
0.8 |
0.2 |
0.15 |
0.5 |
| 18.4 |
10 |
40 |
0.1 |
1 |
0.8 |
0.2 |
0.127 |
0.5 |
| 18.4 |
12 |
48 |
0.1 |
1 |
0.8 |
0.2 |
0.127 |
0.5 |
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| TSOP(II) (All units are in mil. 1mil=25.4um) |
| Body size |
Lead count |
A1 |
A2 |
L1 |
b |
c |
e |
| D1 |
E1 |
| 17.1 |
7.6 |
20/42 |
0.1 |
1 |
0.8 |
0.4 |
0.5 |
1.27 |
| 18.4 |
10.2 |
40/44 |
0.1 |
1 |
0.8 |
0.35 |
0.127 |
0.8 |
| 21 |
10.2 |
44/50 |
0.1 |
1 |
0.8 |
0.35 |
0.127 |
0.8 |
| 22.2 |
10.2 |
54 |
0.1 |
1 |
0.8 |
0.35 |
0.127 |
0.8 |
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| Packing & Shipping |
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| TSOP(I) |
| Body size (mm) |
Row |
Column |
Total QTY |
Temp(°C) |
Vendor |
| 11.8X8 |
13 |
18 |
234 |
150 |
HS |
| 18.4x8 |
13 |
12 |
156 |
180 |
CAMTEX |
| 18.4X10 |
10 |
12 |
120 |
150 |
KOSTAT |
| 18.4X12 |
8 |
12 |
96 |
150 |
HS |
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| TSOP(II) |
| Body size (mm) |
Row |
Column |
Total QTY |
Temp(°C) |
Vendor |
| 17.1X7.6 |
11 |
16 |
176 |
150 |
KOSTAT |
| 18.4x10.2 |
9 |
15 |
135 |
150 |
SHINON |
| 21x10.2 |
9 |
13 |
117 |
150 |
SHINON |
| 22.2x10.2 |
9 |
12 |
108 |
150 |
SHINON |
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