| Item |
2006 |
2007 |
2008 |
| HVM Design Rule Roadmap (unit:um) |
1H (Recovery) |
2H |
End of '07 |
End of '08 |
Layer structure
(N=2 or 4 core layers) |
3+N+3 |
4+N+4 |
4+(1+2+1)+4 |
4+(1+2+1)+4 |
Bump Pad
Design |
Bump Pitch |
180 |
180 |
165 |
150 |
| Bump Pad |
140 |
125 |
120 |
110 |
| SRO diameter |
90 |
85 |
80 |
80 |
| SR alignment |
25 |
20 |
17.5 |
15 |
| Presolder Type |
EU/SAC305 |
EU/SAC305 |
EU/SAC305 |
EU/SAC305 |
| Bump on Via |
Yes |
Yes |
Yes |
Yes |
| Micro Via |
Via structure |
Stagger/2Stack |
2 stack |
3 stack |
3 stack |
| Via diameter |
70 |
60 |
60 |
50 |
| Capture Pad/Land diameter |
130 |
110 |
100 |
90 |
| Pad to via alignment |
30 |
25 |
20 |
20 |
| via to land alignment |
30 |
25 |
20 |
20 |
Through
Hole
Core 400um |
PTH diameter
(core 400um) |
150 |
150 |
100 |
100 |
| Min PTH wall to wall |
170 |
170 |
150 |
150 |
| min PTH pitch (same net) |
320 |
320 |
250 |
250 |
| PTH Land diameter |
300 |
250 |
170 |
150 |
| PTH to land alignment |
75 |
50 |
35 |
25 |
| Trace Design |
Build-up LYR L/S |
25/25 |
20/20 |
15/15 |
12/12 |
| Cu thickness |
15 |
15 |
15 |
15 |
Inner LYR L/S
(w/ VOP) |
75/75 |
65/65 |
50/50 |
50/50 |
Cu thickness
(w/ VOP) |
27 |
27 |
22 |
22 |
Inner LYR L/S
(w/o VOP) |
50/50 |
50/50 |
40/40 |
35/35 |
Cu thickness
(w/o VOP) |
22 |
22 |
18 |
15 |
| Metal Finish |
OSP + DSOP |
EU / SAC305 |
EU / SAC305 |
EU / SAC305 |
EU / SAC305 |
| OSP |
Pb-free |
Pb-free |
High Temp |
High Temp |
| Immersion Tin + C4 presolder |
IMT + EU |
IMT + EU/SAC305 |
IMT + EU/SAC305 |
IMT + EU/SAC305 |
| ENIG / ENPdIG(Pilot) |
-- |
ENIG |
ENPdIG |
ENPdIG |
