Lead Count Available	First-level Interconnection	Second-level Interconnection	Lead/Ball Pitch	Overall Thickness (mm)
36~676	Wire bonding	Solder ball	0.8/1	1.40~1.70
	Wire bonding	Solder ball	0.5/0.65/0.75/0.8/1	1.20~1.40
	Wire bonding	Solder ball	0.4/0.5/0.65/0.75/0.8	0.80~1.00
	Wire bonding	Solder ball	0.4/0.5/0.65/0.75/0.8	0.65~0.80
	Wire bonding	Solder ball	0.4/0.5/0.65/0.75/0.8	0.50~0.65