Lead Count Available	First-level Interconnection	Second-level Interconnection	Lead/Ball Pitch	Overall Thickness (mm)	Remark
8~ 64	Wire bonding	Terminal	0.5/0.65	0.75	-
8~ 64	Wire bonding	Terminal	0.5/0.65	0.75	Thermally enhanced
8~ 96	Wire bonding	Terminal	0.5/0.65	0.75	Thermally enhanced
12~ 64	Wire bonding	Terminal	0.5/0.65	0.9	Thermally enhanced
32~ 52	Wire bonding	Terminal	0.4/0.5/0.65	0.5~0.9	-
40~400	Wire bonding	Terminal	0.4/0.5/0.65/0.8	0.6~0.85	Low-cost thermally enhanced
8~100	Bumping / Ball drop	-	0.4/0.5/0.65/0.75/0.8	0.5~1	Wafer level package