ASE Kaohsiung TOP > Flip Chip

Flip Chip Flip Chip Package Production Experience Flip Chip Package Roadmap Technology Item Available 2007 2008 2009 CSP (MSL 3) UF Only Package Die (mm) 13x13 7.9x7.9 14x14/ 9.5x9.5 - - UF + Mold 14x22/ 10.0x13.5 - - - Mold Only 7x7/ 5x5 14x14/ 9.5x9.5 - - HFC BGA (MSL3 <40mm) (MSL4 >40mm) 1-pc/ 2-pc HS Package Die (mm) 50x50/ 24x26 52.5x52.5/26x26 DLA 31x31/ 10x10 - - - FC BGA Build-up Package Die (mm) 37.5x37.5/ 8.5.x8.5 No Plan (Recommend HS for PKG size >37.5mm) FC QFN (MSL 2) QFN Package Die (mm) 11x11/ 7.62x7.62 - - - SiP (MSL 4) Multi-Package Package Die (mm) 35x35/ 12x11 - - - Multi-Die 40x40/ 14.5x12.5 - - - Filp Chip Turnkey Solution • Offering > Total Turnkey Solution for Flip Chip (Both 8" & 12") > Bump composition: Eutectic / Hi-Lead / Lead Free • Varied Flip Chip Package type availability > FC-CSP / Low Cost FC-BGA / Build-up FC-BGA / Ceramic FC-BGA & FC-PGA > HiCTE Ceramic FC-BGA 2008 ASE Kaohsiung, All rights reserved. Terms of Use