Technology Item |
Available |
2007 |
2008 |
2009 |
DCOB* |
FOC |
Pitch (um) |
180 |
150 |
- |
- |
REP |
200 |
200 |
150 |
- |
RDL |
Pitch (um) |
I/O |
85 |
75 |
65 |
65 |
Bump |
225 |
200 |
150 |
150 |
aCSP (um) |
REP |
Ball Pitch (um) |
400 |
300 |
200 |
150 |
Ball Size (um) |
250 |
150 |
100 |
80 |
RDL |
Pitch (um) |
I/O |
85 |
75 |
65 |
65 |
Ball |
400 |
300 |
200 |
150 |
Ball Size (um) |
250 |
150 |
100 |
80 |
aCSP (Ball Drop) |
Wafer Size (mm) |
150/200 |
300 |
300 |
300 |
RDL Runner Material |
Sputtered Metal |
Sputtered Metal |
Plated Cu |
Embedded Passives
on Chip |
Fan-out |
WLCSP Structure |
N/A |
Prototype |
Single Die |
Stack |
Package Item |
Available |
2007 |
2008 |
2009 |
Bumping |
UBM |
Al/NiV/Cu
Ti/NiV/Cu
Ti/Cu/Cu/Ni
Ti/Cu/Ni |
- |
- |
- |
Pitch (Printed/Plated, um) |
180/150 |
150/130 |
150/120 |
150/100 |
Bump Composition |
Eutectic
Hi-Pb /Pb-free |
Plated
Pb-free |
- |
- |
Repassivation |
BCB/PI/PBO |
PI New Polymer |
- |
- |
aCSP |
Wafer Thickness (um) |
200mm – 250
300 mm – N/A |
200
250 |
150
200 |
150
200 |
Ball Pitch (um) |
400 |
300 |
200 |
150 |
Ball Size (um) |
250 |
150 |
100 |
80 |